TTM Technologies

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– A top 10 manufacturer, in both manufacturing footprint and sales, of rigid, rigid-flex PCB’s in the world.
– $2.6B in Sales 2022
– 10 facilities in North America totaling approximately 1 million square feet of manufacturing
– 5 facilities in China totaling approximately 4 million square feet of manufacturing
– Seamless manufacturing – choose from local North America facilities and seamlessly transfer to China for high volume production.
– ITAR, MIL-PRF-31032, MIL-PRF-55110, ISO 9001, ISO/TS 16949, TL 9000, AS9100, ISO 14001:2004, UL796, ISO/IEC 17025: 2005, Bellcore Compliant, ISO 14064,
– Target volumes – low single lot quick turn, NPI, pre-production to mass production
– Specializing in Rigid, Rigid-Flex, and Flex
– DFM services (no cost)
– Layers – from 2 through 60 layers
– High-Density Interconnect / High Layer Count
– Advanced Type III HDI
– Micro Via Solutions
– Via-in-Pad & Copper Filled Micro Via
– RoHS Compliant Products and Leaded Capable Manufacturing and Materials
– High Aspect Ratio Plating
– Aspect Ratios as high as 18:1
– RF / Microwave Applications
– Thermal Management Solutions
– Buried Capacitance ZBC Licensed
– Back Drilling
– Heavy Copper UL up to 3oz (do up to 6 oz)
– Complex Backplanes (24” x 50”) up to 400 mils thick

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IEC Electronics Offerings

• Electronic Manufacturing Services (quick turn assembly to production volumes)

• Interconnect Products

• Machining (precision metal working)

• DFx

• Test Labs (DLA certified)

• Custom Design and Fabrication for Automated In-Circuit and Functional Test including boundary scan, RF, HASS, vibration, and dynamic ESS testing
   

Markets served: Military/Aerospace, Medical and Industrial markets with an emphasis in Mission Critical and Life-Saving applications.

Certifications: ISO 9001:2008 certified, ITAR registered, Nadcap and AS9100C certified, ISO 13485 certified, ISO 17025 accredited laboratory, IPC-approved Validation Services test Laboratory

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Our Mission: Align IEC resources with our customer’s needs with an emphasis in problem solving and engineering solutions for the custom manufacturing, product configuration, and verification testing of highly engineered products. Our proven record of executing to this mission allows us to minimize supply chain risk by controlling lead-times, cost and product quality.

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Capabilities:

• PCBA, Interconnect, Test and Lab Services are all under one roof, minimizing transit time, simplifying logistics, reducing costs and expedites problem solving.

• Only EMS with an on-site laboratory that has been approved by the Defense Logistics Agency (DLA) for their Qualified Testing Supplier List (QTSL) program which deems the site suitable to conduct various QTSL and military testing standards including counterfeit component analysis

• Functional testing for digital, analog, JTAG compliant devices, and FR from LF to SHF bands

• FDA registered and IQ/OQ/PQ support for medical products

• Leaded or lead-free soldering for IPC-A-610 or J-STD-001 Class 3

• In-house conformal coating including acrylic, silicone, polyurethane, and parylene

• Dedicated engineering staff to custom design and fabricate molded cable assemblies

• Custom EMI/RFI shielding back shells terminated with over mold boots and strain reliefs

• RF/VSSR testing to super high frequency (SHF)

• Harnessing for complex assemblies with multiple breakouts and junction points

• In-house design engineering services for chassis and enclosure design

• CNC machining, sheet metal fabrication, laser cutting, welding

• Plating, painting, graining, and silk screening finishing services

• Logistics management and direct order fulfillment to the end customer

• 3 US Locations totaling approximately 350,000 Sq. Ft. of manufacturing

 

 

 

 

 

 

Hana
World Class Asia Contract Manufacturing and Semiconductor Packaging and Test
• Assembly and test of low/medium IO IC’s
• Custom packages, MEMS, SENSORS and OPTO devices
• Chip on Board
• Chip on Flex
• Flip Chip
• PCBA Assembly
• Hybrid Modules
• Box Build
• SIP
– ISO14001, ISO13485, TS16494

 

 

 

 

 

HCC
– Flex (Manufactured In China w/ Local Warehousing)
– Up to 8 layers for both Flex and Rigid Flex
– China manufacturing
– Impedance control: +/- 10%
– Panel Size: 18″ x 24″
– Shielding: Copper and Silver Epoxy
– Finish: Hard/Soft/Immersion Gold, Tin/Lead, Tin, Gold fingers (to 50 micron)
– Line and Space: 3 mil
– Minimum hole size: 8 mil
– Minimum copper thickness: 1/3 oz.
– Cover: P.I., P.I.C., and Flexible Solder Mask
– Will do punched (+/- 3 mil) and drilled holes (+/- 8 mil)
– Will also do flexible circuit assembly which is collocated in the same campus
– QS9002, ISO9002, UL, RoHS Compliant

 

 

 

 

 

Ranoda Technology, LLC
Providing interconnect solutions inclusive of standard products to customer engineered requirements.
– COMPUTER AND PERIPHERALS CONNECTORS: SATA-SAS-USB 2.0-USB3.0-PCI EXPRESS-DIMM-FPC-FFC-SFF BOARD TO BOARD-MINI USB- MICRO SATA-PCMCIA

– AUDIO VISUAL CONNECTORS: HDMI-DVI-MINIDIN-RCA-D SUB-DISPLAY PORT

– MEDICAL CONNECTORS: BLOOD GLUCOSE METER CONNECTOR

– RF CONNECTORS: F TYPE-SMA-SMB-MCX-MMCX-TNC

– MICRO COAXIAL CONNECTORS: SMA-SMB-RP SMA-MCX-MMCX-PAL(IEC)-F TYPE

– MICRO COAXIAL CABLE ASSEMBLIES; RG 178-RG 316-RG 179-RG 400

– SMA STRAIGHT TO MCX R/A PLUG – SMA STRAIGHT PLUG TO ENDS CABLE

– IPEX JACK 1.37 TO OPEN CABLE- IPX JACK 0.81 TO OPEN CABLE

– IPEX JACK 1.13 WITH FERRITE TO SMA BULKHEAD JACK CABLE

– SMA R/A JACK TO OPEN CABLE

CUSTOMER ENGINEERED SOLUTIONS: MOLDING & STAMPING TOOLINGS FROM CAD GENERATED DRAWINGS.

Cadence Allegro Design Suite
Valor/Frontline Genesis 2000
Downstream Technology CAM350

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Ultra Circuits Design
PCB Design Capabilities

30 Years of Experience in PCB Design and DFM Engineering
Full PCB DFM Support
Complex PCB Design
Commercial and Military Experience
High Speed Digital, RF and Analog Designs
Blind and Buried Via
HDI Micro Via and Via in Pad
Packages : SMT, Thru Hole, Hybrid Boards, BGA, Micro BGA, CSP, FCP, Pitches 1.2 mm, 1.0 mm, 0.8 mm, 0.5 mm
Impedance Control : Microstrip, Coated Microstrip, Coplanar Microstrip, Centered Stripline, Off Center Stripline, Dual Stripline, Horizontal Differential Pairs, Broadside Differential Pairs
Matched Line Lengths
High Current
Standard Deliverables

Allegro Design Data Base
Valor ODB ++
Gerber Data
IPC-D-356 Net List
NC Drill Data
Fabrication & Assembly Drawing
PDF, PLT or DXF Format
SMT Stencil
Component Placement Files
Tools

 

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Custom Silicon Solutions
Full Turn-Key Analog, Mixed-Signal ASIC Supplier
– World-Class team of Analog Design and Test Engineers
– ISO9001 and ITAR Certified
– Support Commercial, Industrial, Medical, Automotive and Military / Aerospace markets
– Over 300 tape-outs since founded in 1996
– All design work and prototype/production testing performed in-house at 30,000 sq ft corporate headquarters located in Irvine, California.