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TTM Technologies

~$2.6B estimated Sales

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• Rigid, Rigid-Flex and Flex Printed Circuit Boards and Electro-Mechanical Solutions

• Top 10 Global manufacturer of PCB’s 

• 26 world wide facilities (12 China facilities and 14 North American sites)

• Seamless manufacturing – choose from local North America facilities and seamlessly transfer to China for high volume production. 

• ITAR, MIL-PRF-31032, MIL-PRF-55110, ISO 9001, ISO/TS 16949, TL 9000, AS9100, ISO 14001:2004, UL796, ISO/IEC 17025:2005,  Bellcore Compliant, ISO 14064

• Target volumes - low single lot quick turn, NPI, pre-production to mass production

• DFM services

• Layers - from 2 through 60 layers

• High Density Interconnect / High Layer Count

• Advanced Type III HDI

• Micro Via Solutions

• Via-in-Pad & Copper Filled Micro Via

• RoHS Compliant Products and Leaded Capable Manufacturing and Materials

• High Aspect Ratio Plating

• Aspect Ratios as high as 18:1

• RF / Microwave Applications

• Thermal Management Solutions

• Buried Capacitance ZBC Licensed

• Back Drilling

• Heavy Copper UL up to 3oz (do up to 6 oz)

• Complex Backplanes (24” x 50”) up to 400 mils thick

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​Hana Microelectronics

Annual Revenue $500M

 

Semiconductor Packaging and Test

Capabilities:

• Assembly and test of low/medium IO IC’s.

• Custom packages and optoelectronic devices.

 

Contract Manufacturing

Capabilities

• Chip On Board

• Chip On Flex

• Flip Chip

• PCB Assembly

• Hybrid Modules

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Raltron
A Rami Technology Company
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Corporate Background: Providing interconnect solutions inclusive of standard products to customer engineered requirements and world-class antenna solutions.

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Capabilities:

• Design and hands-on engineering support for US manufacturing and distribution of frequency management and IoT related products including precision crystal oscillators ~ VCXO s, TCXOs, OCXO’s, ceramic resonators, microwave components ~ VCO’s, PLL ’s, custom modules, Filters, LTCC products ~ Baluns & Diplexers. 
   

• A comprehensive offering of audio components including speakers, piezo and electromagnetic transducers, buzzers and alarms, piezo elements and electret condenser and MEMS microphones.
   

• Comprehensive portfolio of antennas, RF connectors & cable assemblies.

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Ultra Circuits Design

 

PCB Design Capabilities

30 Years of Experience in PCB Design and DFM Engineering

• Full PCB DFM Support

• Complex PCB Design

• Commercial and Military Experience

• High Speed Digital, RF, and Analog Designs

• Blind and Buried Via

• HDI Micro Via and Via in Pad
   

Packages

• SMT, Thru Hole, Hybrid Boards

• BGA, Micro BGA, CSP, FCP

• Pitches 1.2 mm, 1.0 mm, 0.8 mm, 0.5 mm
   

Impedance Control

• Microstrip, Coated Microstrip, Coplanar Microstrip

• Centered Stripline, Off Center Stripline, Dual Stripline

• Horizontal Differential Pairs, Broadside Differential Pairs

 

Matched Line Lengths

High Current

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Standard Deliverables

• Allegro Design Data Base

• Valor ODB ++

• Gerber Data

• IPC-D-356 Net List

• NC Drill Data

• Fabrication & Assembly Drawing

• PDF, PLT or DXF Format

• SMT Stencil

• Component Placement Files

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Tools

• Cadence Allegro Design Suite

• Valor/Frontline Genesis 2000

• Downstream Technology CAM350

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Custom Silicon Solutions
 

• Full Turn-Key Analog, Mixed-Signal ASIC Supplier

• World-Class team of Analog Design and Test Engineers

• ISO9001 and ITAR Certified

• Support Commercial, Industrial, Medical, Automotive and Military / Aerospace markets

• Over 300 tape-outs since founded in 1996

• All design work and prototype/production testing are performed in-house at 30,000 sq ft corporate headquarters located in Irvine, California.